Polymaker PolyMide™ PA6-CF Filament

PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.

PolyMide™ PA6-CF is a carbon fiber reinforced PA6 (Nylon 6) filament. The carbon fiber reinforcement provides significantly improved stiffness, strength and heat resistance with outstanding layer adhesion.

PolyMide™ PA6 GF features Polymaker’s Warp-Free™ technology and Fiber Adhesion™ technology:

Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.

Fiber Adhesion™ technology improves the layer adhesion of fiber reinforced materials, by optimizing the surface chemistry of the fibers to achieve better dispersion and bonding to the matrix. This results in better strength along the Z-axis and reduced mechanical anisotropy.

Printing Properties:

• Nozzle Temperature:
  280˚C – 300˚C *
• Printing Speed:
  60mm/s
• Bed Temperature:
  25˚C – 50˚C (Do NOT exceed 50 ˚C)
• Bed Surface:
  almost any surface with a thin coat of PVA glue or Magigoo PA
• Cooling Fan:
  OFF

*Printing conditions may vary with different printers and nozzle diameters

* We highly recommend to use a wear resistant nozzle such as Ultimaker’s CC Ruby-tipped Print Core for Ultimaker S3 and Ultimaker S5 / S5 Pro Bundle models

Mechanical Properties:

• Young’s Modulus:
  7453 ± 656 (MPa)
• Tensile Strength:
  105.0 ± 5.0 (MPa)
• Bending Strength:
  169.0 ± 4.7 (MPa)
• Charpy Impact Strength:
  13.34 ± 0.52 (kJ/m2)

Thermal Properties:

• Heat Deflection Temperature
  (ISO 75 1.8 MPa):
  196 ˚C
• Heat Deflection Temperature
  (ISO 75 0.45 MPa):
  215 ˚C
• Melting Temperature:
  220 (°C)

Notes:

• Drying Settings:
  80˚C for 12h
• Recommended Support Materials:
  PolyDissolve™ S1

TDS:
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SDS:
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PIS:
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