Bambu Lab PC
₱1,990.00
Product Features
- Exceptional Thermal Resistance
- Excellent Mechanical Properties
- High Impact Strength and Durability
- Suitable for Engineering Purposes
- Comes with High Temperature Reusable Spool
- Diameter: 1.75mm +/- 0.03mm
Cautions for Use
- AMS 2 Pro, AMS HT & AMS Compatible
- AMS lite NOT Compatible
- Dry out before use
- Enclosure Printers Required
Bambu Lab PC is a professional, engineering-grade polycarbonate filament designed to provide exceptional mechanical toughness, dimensional stability, and high thermal resilience for demanding industrial components. The filament includes an integrated RFID smart chip for instant material configuration when fed into automated material handling ecosystems, and it ships securely wound on a specialized, high-temperature reusable spool that safely resists deformation during the mandatory pre-print oven drying cycles.
- High Stress & Impact Resistance: Built to handle demanding mechanical stress
- Thermal Stability: Performs reliably under high temperatures
- Precision & Clarity: Excellent dimensional accuracy and transparent options
- Versatile Applications: Ideal for engineering applications, functional prototypes, and mechanical components
- Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
- Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer’s heatbed.
RFID for Intelligent Printing
- All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System). Load and print! No more tedious setting steps.
Additional information
| Diameter | 1.75 mm |
|---|---|
| Net Filament Weight | 1 kg |
| Spool Material | PC + ABS (Temperature resistance 90 ° C) |
| Spool Size | Diameter: 200 mm; Height: 67 mm |
| Drying Settings before Printing | 80 ° C, 8 hours |
| Printing and Storage Humidity | < 20% RH (Sealed with desiccant) |
| Nozzle Temperature | 260 – 280 ° C |
| Bed Type | Engineering Plate, High Temperature |
| Bed Surface Preparation | PVP Glue |
| Bed Temperature | 90 – 110 ° C |
| Cooling Fan | 0 – 60% |
| Printing Speed | ＜300 mm/s |
| Retraction Length | 0.8 – 1.4 mm |
| Retraction Speed | 20 – 40 mm/s |
| Chamber Temperature | 45 – 60 ° C |
| Max Overhang Angle | ~ 70° |
| Max Bridging Length | ~ 40 mm |
