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Bambu Lab PC-FR
₱2,199.00
Product Features
- UL 94-2023 V-0 Flame Retardancy
- Engineering-Level Mechanical Properties
- Comes with High Temperature Reusable Spool
- Diameter: 1.75mm +/- 0.03mm
Cautions for Use
- AMS 2 Pro, AMS HT & AMS Compatible
- AMS lite NOT Compatible
- Dry Out Before Use
Bambu Lab PC-FR
Bambu PC FR is a high-performance polycarbonate engineered for demanding applications requiring superior flame retardancy, impact resistance, and heat stability. With outstanding durability, Bambu PC FR excels across a wide range of professional applications, including industrial components, protective casings, and high-temperature environments in sectors like automotive, electronics, and manufacturing.
Top-Tier Flame Retardancy
Tested to meet the UL 94-2023 V-0 standard, the top level of flame resistance for 3D printing filament, Bambu PC FR is engineered to prevent or slow flame propagation with exceptional self-extinguishing properties. Ideal for critical applications in electronics, automotive, and mechanical engineering.
* UL 94 is a plastics flammability standard established by Underwriters Laboratories (USA). V-0—the highest UL 94 V rating—indicates that burning stops within 10 seconds on a vertically positioned specimen, with dripping particles allowed as long as they are not ignited.
Engineering-Level Mechanical Properties
Bambu PC FR is an engineering-grade material with toughness comparable to PAHT-CF. Its exceptional stiffness and strength make it a top choice for structural components and protective casings.
Additional information
| Diameter | 1.75 mm ± 0.03 mm |
|---|---|
| Net Filament Weight | 1 kg |
| Spool Material | PC+ABS (Temperature resistance 90 °C) |
| Spool Size | Diameter: 200 mm; Height: 67 mm |
| Drying Settings before Printing | Blast Drying Oven: |
| Printing and Storage Humidity | < 20% RH (Sealed with desiccant) |
| Nozzle Size | 0.2, 0.4, 0.6, 0.8 mm |
| Nozzle Temperature | 260 – 280 °C |
| Build Plate Type | Smooth PEI Plate / Textured PEI Plate |
| Bed Surface Preparation | Glue |
| Bed Temperature | 90 – 110°C |
| Cooling Fan | 0 – 60% |
| Printing Speed | < 300 mm/s |
| Retraction Length | 0.8 – 1.4 mm |
| Retraction Speed | 20 – 40 mm/s |
