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Bambu Lab PC:

A high-performance Polycarbonate filament engineered for demanding engineering applications. Known for its remarkable impact strength and superior thermal stability, this material can withstand temperatures up to 117 °C without deformation. It is designed for low shrinkage and excellent dimensional stability, making it the go-to choice for functional prototypes and industrial components that face high-stress environments.

Exceptional Thermal Resistance and Mechanical Properties.

 

 

 

Additional information

Diameter

1.75 mm

Net Weight

1 Kg

Reinforcement

N/A (pure polycarbonate)

Heat Deflection Temp

117 °C

Nozzle Temp

260 – 280 °C

Bed Temp

90 – 110 °C

Abrasiveness

Low (standard nozzle compatible)

Feature

Integrated RFID

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