Bambu Lab PC:
A high-performance Polycarbonate filament engineered for demanding engineering applications. Known for its remarkable impact strength and superior thermal stability, this material can withstand temperatures up to 117 °C without deformation. It is designed for low shrinkage and excellent dimensional stability, making it the go-to choice for functional prototypes and industrial components that face high-stress environments.
Exceptional Thermal Resistance and Mechanical Properties.
Additional information
| Diameter | 1.75 mm |
|---|---|
| Net Weight | 1 Kg |
| Reinforcement | N/A (pure polycarbonate) |
| Heat Deflection Temp | 117 °C |
| Nozzle Temp | 260 – 280 °C |
| Bed Temp | 90 – 110 °C |
| Abrasiveness | Low (standard nozzle compatible) |
| Feature | Integrated RFID |





Reviews
There are no reviews yet.