Roll over image to zoom in
Bambu Lab ABS
Price range: ₱649.00 through ₱749.00
Product Features
- Tough and Durable
- Good Heat & Freezing Resistance
- Comes with High Temperature Reusable Spool
- Diameter: 1.75mm +/- 0.03mm
Cautions for Use
- AMS 2 Pro, AMS HT & AMS Compatible
- AMS lite NOT Compatible
- Enclosure Printers Required
* Note: The refill needs to be used with a spool.
Bambu Lab ABS
Bambu ABS is a dependable 3D printing material renowned for its exceptional stability, durability, and high impact resistance. Additionally, this filament boasts excellent heat resistance, making it ideal for projects involving moderate temperatures. With its versatile properties, Bambu ABS filament stands as an excellent choice for a wide range of 3D printing applications.
Strong & Durable
As one of the most widely used filaments, Bambu ABS comes with excellent mechanical properties that make it stronger than normal PLA and PETG. It is ideal for creating functional parts, prototypes, and standard engineering components, ensuring long life and reliability.
Impressive Heat Resistance
Bambu ABS filament offers exceptional heat resistance (Heat Deflection Temperature: 87 °C) coupled with commendable mechanical properties. This makes it an outstanding choice for everyday functional parts that require high-temperature resistance.
Water-Resistant
Boasting excellent water-resistant performance, Bambu ABS ensures relatively long-lasting durability when used in a wet environment.
Tough with High Impact Resistance
Bambu ABS is exceptionally robust, and its prints can withstand multiple impacts, collisions, and falls. It exhibits good impact resistance even at low temperatures.
Additional information
| Diameter | 1.75 mm |
|---|---|
| Net Filament Weight | 1 kg |
| Spool Material | PC + ABS (Temperature resistance 90 ° C) |
| Spool Size | Diameter: 200 mm; Height: 67 mm |
| Drying Settings before Printing | Blast Drying Oven: 80 °C, 8 h |
| Printing and Storage Humidity | < 20% RH (Sealed, with desiccant) |
| Nozzle Size | 0.2, 0.4, 0.6, 0.8 mm |
| Nozzle Temperature | 240 – 270 ° C |
| Build Plate Type | Engineering Plate, High Temperature Plate |
| Bed Surface Preparation | Glue |
| Bed Temperature | 80 – 100 ° C |
| Cooling Fan | 0 – 80% |
| Printing Speed | < 300 mm/s |
| Retraction Length | 0.8 – 1.4 mm |
| Retraction Speed | 20 – 40 mm/s |
| Chamber Temperature | 45 – 60 ° C |
| Max Overhang Angle | ~ 70° |
| Max Bridging Length | ~ 40 mm |
Reviews
There are no reviews yet.