Bambu Support for PLA

569.00

In stock

Product Features

  • Effortless Removal
  • Preserve Every Detail
  • Affordable Choice
  • Use for Support Interface
  • Diameter: 1.75mm +/- 0.05mm

Cautions for Use

  • Only Used for Printing the Support Interface
  • Avoid Printing Individual Models
  • All AMS Series Compatible
SKU: S02-W1-1.75-500-SPL Categories: , , , Brand:

Bambu Support for PLA

Bambu Support for PLA is fully compatible with all Bambu Lab PLA filaments and Bambu Lab printers, offering effortless peel-off removal, smooth interface quality, with reliable performance. It eliminates the need for post-processing, saving time while delivering flawless results. All at a budget-friendly price. Upgrade your 3D printing experience today!

Effortless Removal

Bambu Support for PLA is specifically designed for PLA filaments, ensuring clean, residue-free removal by hand. Say goodbye to post-processing and enjoy a seamless 3D printing experience.

Preserve Every Detail

With optimized support interface settings* in Bambu Studio, Bambu Support for PLA delivers an ultra-smooth contact surface that protects intricate details as if untouched. Perfect for delicate designs, overhangs, and bridges, it ensures premium quality from start to finish.

* 0mm top interface spacing and 0mm Z-distance settings

Affordable Support, Premium Performance

Bambu Support for PLA delivers enhanced performance at 34% less cost than its predecessor. Enjoy greater stability, improved printability, and better results, all while saving money.

Additional information

Diameter

1.75 mm

Net Filament Weight

0.5 kg

Spool Material

ABS (Temperature resistance 70 °C)

Spool Size

Diameter: 200 mm; Height: 67 mm

Drying Settings before Printing

Blast Drying Oven: 55 °C, 8 h
X1 Series Printer Heatbed: 65 – 75 °C, 12 h

Printing and Storage Humidity

< 20% RH (Sealed, with desiccant)

Nozzle Size

0.2, 0.4, 0.6, 0.8 mm

Nozzle Temperature

220 – 230 °C

Bed Type

Cool Plate SuperTack, Textured PEI Plate /
Smooth PEI Plate

Bed Surface Preparation

Bambu Liquid Glue / Glue Stick

Bed Temperature

35 – 45 °C

Cooling Fan

Turn on

Printing Speed

< 200 mm/s

Retraction Length

0.6 – 1.0 mm

Retraction Speed

20 – 40 mm/s

Chamber Temperature

25 – 45 ° C

Max Overhang Angle

55 °

Max Bridging Length

30 mm

Support

Turn On

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Bambu Support for PLA

Bambu Support for PLA

569.00

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