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Bambu Lab H2C High Flow Induction Hotend
₱4,750.00
Multi-Material Printing with Less Waste
The Vortek System uses up to six interchangeable induction-heated hotends to achieve true multi-material printing with significantly reduced purge waste compared to single-nozzle systems. The hotend swap mechanism eliminates purge flushing during filament changes (H2C under 7 filaments), saving both material and time.
Fast and Precise Induction Heating
The Vortek Induction Hotend rapidly heats the nozzle to printing temperature in approximately 8 seconds (PLA). This fast response shortens color-change transitions and further reduces purge waste. Integrated overheat, overvoltage, short-circuit, and open-circuit protection ensure reliable performance during continuous multi-material workflows.
Reliable Contactless Connection
Instead of contact-based metal pins—which can oxidize and degrade over time—the Vortek System employs a contactless, high-frequency power and signal interface. This delivers a stable, long-lasting connection for accurate temperature control and synchronized hotend operation.
Heatsink Overheat Monitoring
Dual temperature sensors monitor both nozzle and heatsink temperatures in real time. When heatsink temperature exceeds safe limits, the system automatically increases cooling to prevent heat creep and reduce the risk of clogging.
Intelligent Multi-Hotend Management
Each Vortek Hotend stores its filament information locally, ensuring correct material mapping and preventing loading errors. When printing with more than seven filament types, the system intelligently optimizes hotend mapping to minimize purge waste and improve overall efficiency.
Additional information
| Nozzle Type | Induction-Heated Quick-Swap (Vortek Rack Compatible) |
|---|---|
| Nozzle Material | Hardened Steel (Standard) / Stainless Steel (0.2 mm) |
| Nozzle Diameters | 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm |
| Max Printing Temp | 350 °C |
| Max Volumetric Flow (High Flow) | 40 mm³/s |
| Max Volumetric Flow (Standard) | 25 – 30 mm³/s |
| Heating Speed | ~8 seconds to PLA temperature |
| Hotend Length | 49.2 mm |
| Connection | Contactless High-Frequency Power & Signal Interface |
| Feature | Integrated filament memory chip and dual-sensor heatsink monitoring |
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